Thermal Interface Materials (TIM)
. Product Introduction
Thermal Interface Materials (TIM)
TIM / Thermal Gels / Ceramic & Composite Materials
Circuit Board Materials
FCCL / Process Application Auxiliary Materials & Consumables
- Product Applications
(Thermal Interface Materials)
TIM: Carbon Fiber Thermal Pads
High Thermal Conductivity × Lightweight × Ultra-Thin (>50 W/m·K)
The core value lies in thermal management efficiency and system integration flexibility, making these materials particularly suitable for high power density, space-constrained, and weight-sensitive applications.
Typical Applications
- GPU / SoC / RF Modules
- Tablets / Notebooks
- VR / AR Devices
- Gaming Consoles, Wearable Device